Recent reports have often maintained that the iPhone 7 will ditch the 3.5 mmheadphone jack in favor of the lightning port which will output Hi-res audio to your favorite pair of headphones. However, new parts leaked on Weibo along with some new reports, it looks like the iPhone 7 may keep the 3.5 mm headphone jack after all.

Recently, LeEco, in order to beat Apple, launched two smartphones with the audio via USB Type-C ditching the 3.5mm headphone jack.

Leaked iPhone components show that the phone will keep the headphone jack. The parts also show the rumored dual camera setup of the iPhone 7 Pro and some SanDisk memory chips of up to a size of 256GB.


Interestingly, this leak also shows some dual-sim capabilities on the Apple iPhone 7. If true this would be the first iPhone to support dual sim capabilities.

With so many supposed leaks happening, it is quite unclear on what the specifications of the final iPhone 7 will be. Earlier reports suggested that the dual camera setup had been scrapped, However, it seems to have returned. Apparently, Samsung, Oppo, Vivo and Xiaomi are also exploring dual-lens cameras for their upcoming smartphones.


Share this article


Founder and Chief Editor of Colabyte, Jitendra Malviya likes to keep on top of technology and loves to help people around him get through the day to day trouble they face with technology. So that, they can love technology as much as he does!

Facebook Comments

Post a comment